Ana Sayfa / Applications
Component sourcing by application
The same capacitor is sourced differently for a ten-year industrial controller and a six-month consumer launch. Each section below lists the typical BOM structure, the families that drive supply risk, and what to send with the RFQ.
Endüstriyel otomasyon
PLCs, I/O modules, HMIs and drives stay in production for ten years or more. The main risk is not price but a part going EOL in the middle of the product’s life, followed by a costly requalification.
MCU VE İŞLEMCİLERAnalog & interfaceConnectors & relaysIsolated power
- Send lifecycle concerns with the RFQ: we flag NRND and EOL lines and quote last-time-buy quantities
- State the temperature grade; industrial (−40 to +85 °C) and commercial codes differ by suffix
- Name the AML second sources, so an approved alternative can be quoted at once
Edge AI & AIoT
Gateways, smart cameras and connected sensors combine an application processor, external DDR and Flash, a wireless module and several sensors. Memory and processors drive both cost and lead time.
- Give memory density, speed grade and package; DRAM prices move with the market
- Say whether the wireless line is a chip or a certified module
- BGA parts: state MSL handling and dry-pack requirements
Motor kontrolü ve robotik
Servo drives, BLDC controllers, AGVs and robot joints: an MCU or DSP with motor-control peripherals, gate drivers, power MOSFETs or IGBTs, current sensing and encoder interfaces. Send voltage and current ratings with any MOSFET or driver line, and the package, because thermal design rarely allows a package change. Related: Discrete & power · Kapı sürücüleri · MCU
Güç ve enerji
Inverters, chargers, BMS and power supplies: PWM controllers, isolated gate drivers, SiC and Si power devices, film and electrolytic capacitors and current sensors. Ratings, creepage and safety approvals matter more than price; state the approvals each line must carry. Related: Power semiconductors · Kapasitörler · Current sensors
Tüketici elektroniği
Wearables, chargers, smart home devices and accessories have short product cycles and tight cost targets. The BOM is dominated by passives, power ICs and a wireless SoC, and a single short line can delay a launch window.
- Send the full BOM: one kit avoids chasing many small orders
- Mark lines where an equivalent passive is acceptable; it widens the sources
- Give the build date; we quote lead time against it
Akıllı ses ve sesli komut
Smart speakers, headsets and voice controllers use an audio SoC or DSP, a codec, Class-D amplifiers, MEMS microphones and a Bluetooth or Wi-Fi link. Amplifier and codec choices are tied to firmware, so alternatives need early review.
Application questions
My application is not listed. Can you still help?
Yes. The sections above are examples. Send the BOM or part numbers with the operating conditions, and we source them the same way.
Do you support automotive or medical builds?
We source parts for these markets on request, but we do not hold IATF 16949 or ISO 13485 certification. State the grade and document requirements, and we tell you before you order which ones we can meet.
Can you review a BOM for lifecycle risk before we build?
Yes. Lines that are NRND, EOL or single-source are flagged with candidate alternatives. See Alternatives & engineering review.